Molex, Amphenol, and TE have launched new high-speed backplane connectors

As AI technology and smart driving are booming, the demand for data processing speed and capacity is growing explosively, and the demand for efficient data transmission has brought many challenges to the connector industry. Recently, Amphenol , TE, Molex and other leading connector manufacturers have launched a number of high-performance connector products that can meet the connection needs of AI, data centers, autonomous driving, industrial automation and other fields.

Molex

CX2 Connectors and CX2 Dual Speed Connectors and Cable Assemblies

CX2 connectors and CX2-DS connectors and cable assemblies help customers meet AI-driven demands for higher speeds and greater capacity, providing near-chip cable connector solutions. They support next-generation data rates and enable chip-to-chip direct connection system architectures. These systems support the transmission of high-speed signals from near the chip to other parts of the system via twin-axial cables, significantly improving signal integrity (SI) and system performance compared to using PCB traces.

▲ CX2 connector and CX2-DS connector

Features and advantages

Supports next-generation data rates up to 112G (CX2) or 224G (CX2-DS)

The pin layout of the isolated transceiver/receiver uses an innovative shielding structure and is equipped with a high-performance twinaxial cable, which helps achieve a transmission rate of up to 112Gbps on the CX2 connector. The CX2-DS is an enhanced version of the CX2 with doubled/enhanced signal rate and bandwidth. The CX2-DS connector can achieve a transmission rate of up to 224Gbps.

Improves reliability and ensures that connectors are fully seated to prevent mismating and accidental disconnection

The two-piece mating kit consisting of the connector and receptacle features a mechanical wipe and can be secured with a latch or screw.

Maximize system performance and extend connectivity within the box

Cable assemblies use 31 AWG (CX2) or 30 AWG (CX2-DS) twinaxial cable to support BiPass

Cable system architecture solutions.

Minimizes the risk of damage to PCB connector pins during installation

The fully protected, anti-mating interface simplifies assembly and helps ensure that the connectors mate securely.

Ability to reduce crosstalk and improve signal integrity, enabling higher signal rates. This design ensures high-speed performance while minimizing signal degradation.

Amphenol

Paladin®

Amphenol’s Paladin® high-density interconnect system is at the forefront of innovation. With support for bandwidths up to 112Gb/s to 224Gb/s, the system sets a new benchmark for all high-speed applications. Designed to meet the most demanding data-intensive environments, it offers industry-leading density, accommodating up to 144 differential pairs in a 1U pitch.

Ideal for cloud servers to achieve high-performance computing, the Paladin® High-Density Interconnect System features a balanced pair structure consisting of individually assembled and independently shielded differential pairs, and a uniquely designed hybrid board attachment to significantly increase density and optimize electrical performance.

ExaMAX® Backplane Connectors

Amphenol’s ExaMAX® backplane connector system is a revolutionary technology. It supports data transmission rates up to 25G to over 112G, complies with PCIe® Gen4 and even exceeds PCIe® Gen7 level specifications, and supports seamless upgrades without compromising performance. The backplane connector system is designed to meet 56Gb/s PAM4 level industry specifications, provides sufficient SI margin, and is compatible with the interfaces of earlier ExaMAX® products.Amphenol’s new EXAMAX2® backplane connector system complies with 112Gb/s PAM4 level industry specifications and is optimized to meet the stringent electrical and mechanical requirements of 112G systems. In addition, the system features a rugged design that meets stringent space constraints, making it an ideal solution for compact applications with high-density requirements. The connector is optimized to provide excellent signal integrity, thereby reducing crosstalk noise and improving insertion loss to crosstalk ratio.

XCede® High-Density Backplane Connectors

Amphenol’s XCede® high-density backplane connector is a major leap forward in high-speed data transmission technology, with amazing transmission performance up to 20 Gb/s. The connector uses a hard metric form factor and provides an outstanding linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter). Compared to the standard XCede@ connector, this represents a significant 35% increase in density, making it a leader in high-density interconnect solutions.This series of connectors is available in 85Ω and 100Ω impedance versions, which can be customized according to specific needs, with high quality and low price, and support for free expansion. XCede® high-density connectors combine cutting-edge technology, density upgrades and support for multi-functional configurations, setting a new benchmark for high-performance data connections in demanding applications.

AirMAX®

AirMAX® is the legacy brand of Amphenol’s hard metric backplane connector series, supporting a variety of serial structures. AirMAX® is compatible with the ExaMAX® series, and its guide modules and power modules play an important role in ensuring easy integration with the Open Compute Project (OCP) design. AirMAX® complies with industry standards and specifications, and the components used promote the application of high-speed interconnect solutions, thereby improving the connection efficiency and scalability of different platforms.

TE

Paladin®

TE Connectivity’s (TE) Z-PACK high-speed backplane solution has always been the preferred choice of backplane connection system designers , providing a variety of transmission speeds, flexible design, coupled with sustained and stable performance, low cost and high efficiency, and can always take into account all kinds of needs.

TE’s Z-PACK HM-ZD connector portfolio further boosts high-speed backplane connections. Focusing on the next-generation applications of Advanced Telecommunications Computing Architecture (ATCA), this portfolio can provide data transmission rates from 12.5Gbp/s to 56Gbp/s, while retaining backward compatibility with previous versions of the HM-ZD series, making field upgrades more convenient. The HM-ZD connector portfolio includes traditional and coplanar architecture options, and will be mainly used in data centers (including servers and routers) as well as test/measurement, medical imaging, and industrial automation markets.

Key Benefits

Backward compatibility, Z-PACK HM-eZD++ receptacles can be mated with existing Z-PACK HM-ZD headers for field data rate upgrades
Available in a variety of data rate options: Z-PACK HM-ZD (12.5 Gbps), HM-ZD+ (15 Gbps), HM-eZD+ (2025 Gbps) and HM-eZD++ (56 Gbps) (PAM4) and 32 Gbps (NRZ)
Suitable for Advanced Telecom Computing Architecture (ATCA) with various traditional and coplanar options
Global design and engineering support enables TE to provide a wide range of products for customers to choose from

Main Features

Z-PACK HM-eZD++ connector supports 56 Gbps data transfer rate, density up to 30DP/inch, and improved electrical performance
Headers and sockets of different data rate versions are compatible with each other
eZD++ connectors feature smaller plated through-hole sizes (minimum 0.31mm for signal pins and 0.36mm for ground pins), providing greater design flexibility and better high-frequency performance
Pre-alignment and polarization features are integrated into the rugged mating design, and a solid ground shield increases mechanical durability
High durability, up to 200 mating cycles (maximum), resistant to 50G mechanical shock
Operating temperature: -55°C to 105°C

As users’ requirements for transmission speeds become higher and higher, high-speed backplane connector suppliers continue to optimize their products. The adjustments mainly include the use of flexible interference connection circuit board technology, which allows the holes of the circuit board to be made smaller, and the use of customized plastics to compensate for signal delays, or the recommendation of expanding the holes in the circuit board. The development of semiconductor technology enables high-speed connector manufacturers to showcase their higher-frequency products. The high-speed connector market has experienced an era of explosive growth in new interfaces, and these new interface high-speed backplane connectors are fully prepared to meet the competition of the new generation of applications. At present, the global backplane communication connector market is mainly dominated by overseas leading companies, and the main manufacturers include SAMTEC, Amphenol, Molex, TE, etc. The above four companies have a total of nearly 600 invention patents related to high-speed backplane connectors. Due to the high technical difficulty of high-speed backplane connectors, overseas companies have made relevant layouts earlier. According to the “Research Report on Key Electronic Components (Abbreviated Version)” of China International Engineering Consulting Co., Ltd., in the field of high-speed connectors of 25Gbps and above, the three major American giants, Tyco, Amphenol, and Molex, have acquired and mutually authorized patents . The above four companies have a total of nearly 600 invention patents related to high-speed backplane connectors. Due to the long-term monopoly, a market pattern of “one dominant company and three strong companies following” has been formed. Domestic manufacturers are currently starting to buy authorized OEMs from these companies to produce some low-end products themselves. The ones that are doing better at present are Huafeng, Qinghong, AVIC Optoelectronics, Luxshare , Yihua, Dingtong, and Xiangfang Electronics . With the rapid development of the IT industry, the diversity of transmission quality, speed, and application levels has triggered a continuous driving force for the development of faster transmission speeds. In order to increase the signal transmission speed, all individual components must be able to minimize signal attenuation, distortion, and anti-interference. Therefore, high-speed connectors as transmission “bridges” also need to be upgraded, because they play an increasingly important role in transmission quality and speed. In the 224Gbps rate era, in order to pursue higher port density, connector companies will evolve towards QSFP-DD connectors that support 800G port capacity in the future. At present, QSFP-DD connectors are only used on relatively high-end servers, and internal storage connectors are mainly Mini-SAS and Mini-SAS HD, which will use more high-speed backplane connectors such as Gen Z, Slim SAS, and MCIO. With the growing demand for applications, China’s AI server shipments continue to grow. With the accelerated development of downstream industries, high-speed backplane connectors, as an important component of AI servers, continue to expand their market space. It is expected that in the future, with the rapid development of high-tech industries such as cloud computing, artificial intelligence, autonomous driving 5G/6G, and the metaverse, the market size of high-speed backplane connectors for AI servers in China will continue to grow, and it is expected to exceed 10 billion yuan by 2029. At present, it is known that many listed companies in the cable industry have invested in this track. The rapid increase in computing power demand has driven the demand for AI servers. The transmission rate of backplane connectors has been upgraded to 112G and 224G, driving the rapid increase in the value of high-speed backplane connectors. There is a huge room for replacement by leading domestic manufacturers.